Technical Pathways to Sustainable E-Waste Management: Critical Evaluation of Disassembly and Recycling Strategies for PCBs

Abstract

This study presents a critical evaluation of technical pathways for the sustainable management of Printed Circuit Boards (PCBs) within the framework of a circular economy. As electronic waste (e-waste) continues to escalate globally, this research employs a Multi-Criteria Analysis (MCA) integrated with Life Cycle Assessment (LCA) data to compare mechanical, chemical, thermal, and biological recycling strategies. The findings indicate that while hydrometallurgical routes offer superior metal recovery rates (up to 96%), their environmental externalities pose significant challenges for developing infrastructures. Conversely, the study highlights the transformative potential of "Design for Disassembly" (DfD) and Artificial Intelligence (AI), which enhanced component identification accuracy to 98% and reduced disassembly time by 40%. Focusing on the Libyan context, the research proposes a "Mechanical-Automation Hybrid" roadmap as a viable short-term solution to bridge the gap between unregulated manual dismantling and high-tech recovery. The results underscore that the synergy between sustainable material innovation, such as bio-based substrates, and digital intelligence is the primary driver for transitioning e-waste from a toxic liability into a strategic "urban mine."